详细介绍

详细参数

无铅回流焊采用Windows 7系统，中英文界面在綫任意切换，操作简便；

西门子PLC+模块化控制，性能稳定可靠，重复精度更高：

回流焊采用双温度传感器，双安全控制模式，系统异常会自动切断加热电源；

采用上下独立温控和风速可设计，满足各种高精度无铅焊接工艺要求；

新型炉膛设计有效地缩小了大小元件之间的温差，确保焊点可靠性的同时，消除了对元件热损伤的隐患；

阶段式强制冷却系统轻易地实现各类无铅锡膏的冷却速率要求（30/秒）：

回流焊炉可配 支撑和双导轨。

Windows 7 system, in the English and Chinese interface online arbitrary switch, easy to operate;

SIEMENS PLC+ modular control, stable and reliable performance, higher accuracy:

Double temperature sensor, double safety control mode, the system will automatically cut off the heating power supply;

The upper and lower temperature and wind speed can be designed to meet the requirements of various high precision lead free soldering process;

The new furnace design effectively reduces the temperature difference between the size of the components, to ensure the reliability of the solder joints, the elimination of heat damage to the component;

Stage type forced cooling system to easily achieve the cooling rate all kinds of lead-free solder paste requirements (less than 30 DEG C / s):

Reflow soldering can be equipped with central support and dual rail.